These products are specifically designed to soften or loosen the resin bleed and mold flashes from the leadframe. Their compositions allow for effective deflashing with no discoloration on the molded package body.
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The descaler and cleaner are designed for pre-treatment application in semiconductor and connector industries. These products are chloride free and provide good adhesion to achieve high performance in electroplating
The leadframe plating additives are specially designed to enhance the plating performance in different plating systems
These products serve to protect the plated product surface and prevent discolouration without compromising on solderability
The leadframe plating additives are specially designed to enhance the plating performance in different plating systems